90152-2116

Molex
538-90152-2116
90152-2116

製造商：

說明：
集管和線殼 C-Grid PCB Conn DR H n DR Horz Tn-A 16Ck

規格書:
ECAD模型:
下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。
更多資訊
瞭解更多關於Molex 90152-2116的資訊

庫存量: 1,303

庫存：
1,303 可立即送貨
工廠前置作業時間：
21 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$21.13 HK$21.13
HK$19.48 HK$194.80
HK$15.21 HK$410.67
HK$14.55 HK$1,571.40
HK$13.48 HK$3,639.60
HK$12.91 HK$6,622.83
HK$11.75 HK$12,055.50
HK$11.67 HK$29,303.37
HK$10.85 HK$54,488.70

商品屬性 屬性值 選擇屬性
Molex
產品類型: 集管和線殼
RoHS:  
Headers
Socket
16 Position
2.54 mm (0.1 in)
2 Row
2.54 mm (0.1 in)
Through Hole
Solder Pin
Right Angle
Socket (Female)
Tin
2.9 mm (0.114 in)
90152
C-Grid
Board-to-Board, Signal
- 55 C
+ 125 C
Tube
品牌: Molex
觸點材料: Tin
組裝國家: Not Available
擴散國: Not Available
原產國: ID
额定电流: 3 A
外殼顏色: Black
外殼材料: Polyester
產品類型: Headers & Wire Housings
原廠包裝數量: 1
子類別: Headers & Wire Housings
額定電壓: 350 V
零件號別名: 0901522116
每件重量: 1.760 g
找到產品:
若要顯示類似商品，請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8538900000
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

發生意外的錯誤。


有問題嗎？ 請瀏覽幫助中心。
有關特定訂單的問題，請登入您的帳戶。

如有其他問題，請致電800-346-6873或發送郵件至 help@mouser.com 與我們聯絡。