FCM363XABMD-0P-08

Name: Quectel FCM363XABMD-0P-08
Brand: Quectel
SKU: 277FCM363XABMD0P08
Price: 153.06 HKD
Availability: OutOfStock

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Mouser 編號：

277FCM363XABMD0P08

製造商編號：

FCM363XABMD-0P-08

製造商：

Quectel

說明：

多協議模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm

壽命週期:

新產品:

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規格書:

FCM363XABMD-0P-08 規格書

ECAD模型:

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商品屬性	屬性值	選擇屬性
製造商:	Quectel
產品類型:	多協議模組
頻率:	2.4 GHz, 5 GHz
接口類型:	GPIO, I2C, JTAG, SPI, UART, USB
電源電壓 - 最小值:	3.14 V
電源電壓 - 最大值:	3.46 V
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
天線連接器類型:	PCB Antenna
尺寸:	25.5 mm x 18 mm x 3.16 mm
封裝:	Reel
封裝:	Cut Tape
品牌:	Quectel
核心:	ARM Cortex-M33
存儲容量:	8 MB
調製技術:	DSSS/OFDM/DBPSK/DQPSK/CCK/BPSK/QPSK/16QAM/64QAM/256QAM
工作電源電壓:	3.3 V
產品:	Modules
產品類型:	Multiprotocol Modules
接收器靈敏度:	- 95 dBm, - 104 dBm
原廠包裝數量:	500
子類別:	Wireless & RF Modules
類型:	Wi-Fi 6, BLE 5.3

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篩選文檔:

規格書

FCM363XABMD-0P-08 規格書

原產地分類

原產國:: 中國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

FCM363X Wi-Fi 6 & BLE 5.3 Module

Quectel FCM363X Wi-Fi^® 6 and BLE 5.3 Module is a cutting-edge MCU Wi-Fi and BLUETOOTH^® module that offers a high-performance Arm^® Cortex-M33 processor. This module operates at up to 260MHz frequency and supports the IEEE 802.11a/b/g/n/ac/ax protocols and BLE 5.3. The FCM363X module features built-in 1.2MB SRAM and 8MB flash and offers optional PSRAM expansion for more complex applications. This module complies with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards and supports the AES-128 encryption algorithm. The FCM363X module is available in a LCC + LGA form factor with an ultra-compact package size of 25.5mm x 18mm x 3.16mm. This module supports GPIO, SDIO, UART, USB, SPI, and JTAG interfaces by default, and I²C, I2S, ADC, LCD, and PWM interfaces. The FCM363X module is ideal for industrial IoT and smart homes.

特色產品

QUECTEL

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Offers a high-performance processor with a frequency up to 160MHz.

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FCE870Q Module

Offers 4K-QAM and 320MHz bandwidth, delivering a peak data rate of 5.8Gbps.

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FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

High-performance module in an LGA package and supports the IEEE 802.11ax standard protocol.

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FGD966X Wi-Fi 6, BLE 5.4, & 802.15.4 Module

High-performance module in an LGA package with an ultra-compact 12mm x 12mm x 2mm size.

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FCM363X Wi-Fi 6 & BLE 5.3 Module

Cutting-edge MCU Wi-Fi and BLUETOOTH® module.

了解更多

供貨情況

庫存：: 0

您仍可購買此商品作為延期交貨訂單。

發生意外錯誤了。請稍後再試。
在途量:: 100

預期28/8/2026
工廠前置作業時間：: 18

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$153.06	HK$153.06
	HK$133.33	HK$1,333.30
	HK$126.42	HK$3,160.50
	HK$117.05	HK$11,705.00
	HK$110.97	HK$27,742.50
完整捲（訂購多個500）
	HK$107.52	HK$53,760.00

FCM363XABMD-0P-08

製造商： Quectel

說明： 多協議模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm

規格

文件 (1)

規格書

產品與貿易合規

更多資訊

FCM363X Wi-Fi 6 & BLE 5.3 Module

特色產品 QUECTEL

供貨情況

Pricing (HKD)

產品速覽

發生意外的錯誤。

製造商：

Quectel

說明：

多協議模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm

特色產品

QUECTEL