DensiStak™ Board-to-Board Connectors

Amphenol FCI DensiStak™ Board-to-Board Connectors are high-density connectors with a dual-beam contact system to ensure reliable performance. The connectors feature an 11-row design with up to 1034 pin positions and an open-pin field design for added flexibility. The DensiStak connectors offer high-speed performance of up to 16Gb/s and meet PCIe® Gen 4, Ethernet, USB, DP, and MIPI protocols. The Amphenol FCI DensiStak Board-to-Board Connectors are constructed with a UL 94V-0-rated housing material that can withstand harsh environments. The connectors are RoHS and USCAR-2 compliant, ideal for automotive applications, including Advanced Driver Assistance Systems (ADAS). The DensiStak devices are also suitable for servers, data storage, artificial intelligence (AI), industrial, and sensing/instrumentation applications.

結果: 4
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說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 產品
定位數
排數
終端類型
堆疊高度
额定电流
額定電壓
最低工作溫度
最高工作溫度
觸點电镀
觸點材料
外殼材料
封裝
Amphenol FCI 板對板及夾層連接器 DensiStak Header H2 .8mm x 1.25mm 550Pos 11 x 50 3u 8mm STK HT
規格書
520庫存量
最少： 1
倍數： 1
捲: 260

Reel, Cut Tape
Amphenol FCI 板對板及夾層連接器 DensiStak Receptacle R6 .8mm x 1.25mm 550Pos 11 x 50 3u 8mm STK HT
規格書
640庫存量
最少： 1
倍數： 1
捲: 320

Reel, Cut Tape
Amphenol FCI 板對板及夾層連接器 DensiStak Header H2 .8mm x 1.25mm 616Pos 11 x 56 3u 8mm STK HT
規格書
無庫存前置作業時間 10 週
最少： 520
倍數： 520
捲: 260

Headers 616 Position 11 Row Solder 8 mm 800 mA, 4 A 100 VAC, 100 VDC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel
Amphenol FCI 板對板及夾層連接器 DensiStak Receptacle R6 .8mm x 1.25mm 616Pos 11 x 56 3u 8mm STK HT
規格書
無庫存前置作業時間 10 週
最少： 640
倍數： 640
捲: 320

Receptacles 616 Position 11 Row Solder 8 mm 800 mA, 4 A 100 VAC, 100 VDC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Reel