ATS-HK379-R0

Advanced Thermal Solutions
984-ATS-HK379-R0
ATS-HK379-R0

製造商:

說明:
散熱器 Cooler Backing Plate, High Performance, 96x96x6mm, 80mm Hole to Hole, Aluminum

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 649

庫存:
649 可立即送貨
工廠前置作業時間:
13 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$31.81 HK$31.81
HK$29.76 HK$297.60
HK$28.93 HK$723.25
HK$27.29 HK$1,364.50
HK$25.73 HK$2,573.00
HK$24.08 HK$6,020.00
HK$23.26 HK$11,630.00
HK$22.03 HK$22,030.00

商品屬性 屬性值 選擇屬性
Advanced Thermal Solutions
產品類型: 散熱器
RoHS:  
Accessories and Hardware
96 mm
96 mm
品牌: Advanced Thermal Solutions
產品類型: Heat Sinks
系列: ATS-HK
原廠包裝數量: 1
子類別: Heat Sinks
類型: Backing Plate
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所選屬性: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

ATS-HK379-R0 High-Performance Cooler Backing Plate

Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.