W66BL6NB & W66CL2NQ 2Gb/4Gb LPDDR4 DRAM

Winbond W66BL6NB and W66CL2NQ 2Gb/4Gb LPDDR4 DRAM is offered in Single-Die-Package (SDP) and Dual-Die-Package (DDP). The Single-Die-Package (SDP) provides 16Mb x 16DQ x 8-banks x 1 channel with 2Gb (2,147,483,648 bits) density. The Dual-Die-Package (DDP) offers 16Mb x 16DQ x 8-banks x 2 channels with 4Gb (4,294,967,296 bits) density.

結果: 2
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 封裝
Winbond W66CP6RBHAFJ
Winbond DRAM 4Gb LPDDR4/4X, x16, 1600MHz, -40C-105C 416庫存量
最少: 1
倍數: 1
最大: 416

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Winbond W66CP6RBQAFJ
Winbond DRAM 4Gb LPDDR4/4X, x16, 1600MHz, -40C-105C 13庫存量
最少: 1
倍數: 1
最大: 13

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