Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

結果: 6
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 長度 寬度 高度
Advanced Thermal Solutions 散熱器 Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158庫存量
最少: 1
倍數: 1

Advanced Thermal Solutions 散熱器 Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352庫存量
最少: 1
倍數: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions 散熱器 maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93庫存量
最少: 1
倍數: 1

Advanced Thermal Solutions 散熱器 maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104庫存量
最少: 1
倍數: 1

Advanced Thermal Solutions 散熱器 Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86庫存量
最少: 1
倍數: 1

Advanced Thermal Solutions 散熱器 Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29庫存量
100預期27/3/2026
最少: 1
倍數: 1