Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.

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數量 RoHS 產品
類型
合金
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含鉛
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.50mm diameter 25K Bottle
規格書
3庫存量
最少： 1
倍數： 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.5 mm
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.60mm diameter 25K Bottle
規格書
5庫存量
最少： 1
倍數： 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.6 mm
Chip Quik 焊料 焊料 Spheres Sn95.5/Ag4.0/Cu0.5 0.30mm diameter 25K Bottle
規格書
1庫存量
最少： 1
倍數： 1

Solder Spheres Lead Free Sn95.5/Ag04/Cu0.5 0.3 mm
Chip Quik 焊料 焊料 Spheres Sn96.5/Ag3.0/Cu0.5 .044" (1.1mm) diameter 6K Bottle (SAC305 lead-free solder balls)
規格書
10預期23/2/2026
最少： 1
倍數： 1

Solder Spheres Lead Free Sn96.5/Ag3.0/Cu0.5 1.1 mm No