TE Connectivity's (TE) Contact Pad and Pogo Pin Interconnects work together as board-level mating interfaces, providing consistent electrical performance and mechanical stability in a range of applications. These TE contact pads and pogo pins are designed for repeated contact and efficient integration, providing consistent connections in designs that require durability, space efficiency, and manufacturing compatibility. The contact pads offer a robust, all-metal, gold- or platinum-plated solution for surface-mount (SMT) applications. These pads provide an enhanced mating connection compared to standard copper foil. The pogo pins are spring-loaded electrical contacts designed for a compact and stable electrical connection. Pogo pins are typically used with a contact pad or a flat metal surface in power-charging and signal-transmission applications.
