132814

Name: Wakefield Thermal 132814
Brand: Wakefield Thermal
SKU: 567-132814
Price: 2196.3 HKD
Availability: OutOfStock

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Mouser 編號：

567-132814

製造商編號：

132814

製造商：

Wakefield Thermal

說明：

液體冷板、液體冷卻及熱管 Power Module Cooler, Cold Plate/Friction Stir Weld, 3 IGBT, 11.26x6.12x0.79 Inch

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規格書:

132814 規格書 (PDF)

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在途量:: 50

預期16/4/2026
工廠前置作業時間：: 9

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

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Pricing (HKD)

數量	單價	總價
	HK$2,196.30	HK$2,196.30
	HK$1,987.60	HK$19,876.00
	HK$1,850.24	HK$55,507.20
	HK$1,825.74	HK$91,287.00

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商品屬性	屬性值	選擇屬性
製造商:	Wakefield Thermal
產品類型:	液體冷板、液體冷卻及熱管
RoHS:
產品:	Liquid Cold Plates
類型:	Friction Stir Welded
吸熱材料:	Aluminum
長度:	11.26 in
寬度:	6.12 in
高度:	0.79 in
設計目的:	Power Module IGBT
品牌:	Wakefield Thermal
組裝國家:	Not Available
擴散國:	Not Available
原產國:	CN
系列:	FSW
原廠包裝數量:	10

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所選屬性: 0

篩選文檔:

規格書

132814 規格書 (PDF)

Images

Fluid Temperature ISO Bands (PDF)

USHTS:: 8473305000

FSW IGBT 132814 Power Module Coolers

Wakefield Thermal Friction Stir Welded (FSW) IGBT 132814 Power Module Coolers are FSW liquid cold plates designed to cool IGBT power modules. The FSW solid-state welding method seamlessly joins two metal pieces without melting them. Wakefield Thermal FSW 132814 Power Module Coolers are compatible with dissimilar metals and feature a narrow heat-affected zone. These 11.26" x 6.12" x 0.79" (LxWxH) modules provide high-strength joints and are fatigue resistant.

FSW Friction Stir Welded Cold Plates

Wakefield Thermal FSW Friction Stir Welded Cold Plates feature a solid-state welding method, which seamlessly joins metal pieces without melting them. The cold plates use high-strength joints that deliver fatigue resistance even when combining dissimilar metals. The FSW series offers a narrow heat-affected zone compared to traditional welding methods to enhance dimensional stability. The Wakefield Thermal FSW Friction Stir Welded Cold Plates are ideal for various versatile applications, including high-power semiconductors, electric vehicles (EVs), renewable energy systems, data centers, medical equipment, military/aerospace, industrial automation, and telecommunications.