2007215-2

TE Connectivity
571-2007215-2
2007215-2

製造商:

說明:
I/O 連接器 SFP+ 1x1 Cage Assy PCI Press Fit

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 231

庫存:
231 可立即送貨
工廠前置作業時間:
20 週 工廠預計生產時間數量大於所顯示的數量。
數量超過231會受到最小訂單要求的限制。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$47.59 HK$47.59
HK$45.46 HK$13,092.48
HK$44.55 HK$25,660.80
HK$44.06 HK$44,412.48
2,592 報價

商品屬性 屬性值 選擇屬性
TE Connectivity
產品類型: I/O 連接器
RoHS:  
Cages
Through Hole
Press Fit
Right Angle
SFP+
- 55 C
+ 105 C
Tray
品牌: TE Connectivity
組裝國家: Not Available
擴散國: Not Available
原產國: CN
產品類型: I/O Connectors
原廠包裝數量: 144
子類別: I/O Connectors
每件重量: 4.800 g
找到產品:
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所選屬性: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
TARIC:
8536699099
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.