Trench 650V to 1200V XPT™ GenX4™ IGBTs

IXYS Trench 650V to 1200V XPT™ GenX4™ IGBTs are developed using a proprietary XPT thin-wafer technology and a state-of-the-art 4th generation (GenX4™) trench IGBT process. These insulated-gate bipolar transistors feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. The devices exhibit exceptional ruggedness during switching and under short-circuit conditions.

結果: 2
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 技術 封裝/外殼 安裝風格 配置 集電極-發射極最大電壓VCEO 集電極-發射極飽和電壓 柵極發射機最大電壓 連續集電極電流在25 C Pd - 功率消耗 最低工作溫度 最高工作溫度 系列 封裝
IXYS IGBT 650V, 180A, XPT Gen5 A5 IGBT in TO-264 355庫存量
最少: 1
倍數: 1

Si TO-264-3 Through Hole Single 650 V 1.2 V 20 V 400 A 1.15 kW - 55 C + 175 C Trench Tube
IXYS IGBT 650V, 220A, XPT Gen5 A5 IGBT in TO-264 400庫存量
最少: 1
倍數: 1

Si TO-264-3 Through Hole Single 650 V 1.15 V 20 V 510 A 1.61 kW - 55 C + 175 C Trench Tube