XM-A119-0404D

Quantic X-Microwave
433-XM-A119-0404D
XM-A119-0404D

製造商:

說明:
RF 開發工具 Amplifier, NBB-300 [PCB: 2]Recommended Bias Controller: XM-A2K1-0404D-SP

庫存量: 5

庫存:
5 可立即送貨
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$1,172.42 HK$1,172.42

備用包裝

製造商 元件編號:
包裝:
Poly Bags
供貨情況:
庫存量
價格:
HK$1,172.42
最小值:
1

商品屬性 屬性值 選擇屬性
Quantic X-Microwave
產品類型: RF 開發工具
RoHS: N
Prototype Boards
Gain Block Amplifiers
品牌: Quantic X-Microwave
封裝: Poly Bags
產品類型: RF Development Tools
系列: A119
原廠包裝數量: 1
子類別: Development Tools
公司名稱: X-MWblock
零件號別名: NBB-300-T1
每件重量: 2.835 g
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所選屬性: 0

CAHTS:
9030820000
USHTS:
9030820000
KRHTS:
9030820000
TARIC:
9030820000
MXHTS:
9030820100
ECCN:
5A991.g

Amplifier Solutions

Quantic X-Microwave Amplifier Solutions offer modular design system technology for the RF and microwave industry. RF and microwave engineers use X-MWblock® modular building blocks to quickly assess prototypes and create efficient, cost-effective, advanced systems. Applications include wireless infrastructure, radar, navigation, transportation, quantum computing, medical devices, test and measurement. The Quantic X-Microwave amplifier category provides solutions for various component manufacturers, including AmpliTech, Analog Devices, Atlanta Micro, Guerrilla RF, Keysight, MACOM, Marki Microwave, Maxim Integrated / Analog Devices, Microsemi / Microchip, Microwave Technology, Mini-Circuits, mmTron, Qorvo, Renesas, Skyworks, Spectrum Control, Teledyne Defense Electronics (TDE), and Texas Instruments.

Get On The Grid

Quantic X-Microwave Get On The Grid is part of the X-Microwave System for RF and Microwave design. X-MWblocks revolutionize RF signal chain optimization with drop-in flexibility, negating the need for soldering or cumbersome evaluation board connections. These blocks are complemented by programming tools like the Raspberry Pi Controller, streamlining the design process. The X-MWblocks can be effortlessly moved from prototype plates into standard or custom connectorized housings, eliminating the need for solderless interconnects. The devices can be incorporated into a single PCB for more integrated solutions, replacing spring pins with soldered wires. Miniaturization is also an option, ensuring compatibility with other grid modules.