IHHP0806ABER1R0M01

Vishay / Dale
70-IHHP0806ABR1R0M01
IHHP0806ABER1R0M01

製造商:

說明:
功率電感器 - SMD 1uH 20% Low Profile High Current

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 9,700

庫存:
9,700 可立即送貨
工廠前置作業時間:
17 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
包裝:
完整捲(訂購多個2000)

Pricing (HKD)

數量 單價
總價
零卷 / MouseReel™
HK$2.06 HK$2.06
HK$1.72 HK$17.20
HK$1.42 HK$142.00
HK$1.13 HK$1,130.00
完整捲(訂購多個2000)
HK$1.05 HK$2,100.00
HK$1.02 HK$4,080.00
HK$0.97 HK$9,700.00
† HK$55.00 MouseReel™費用將加入您的購物車內並自動計算。所有MouseReel™訂單均不能取消和不能退換。

商品屬性 屬性值 選擇屬性
Vishay
產品類型: 功率電感器 - SMD
RoHS:  
High Power Inductor
0806 (2016 metric)
Shielded
1 uH
20 %
2.7 A
58 mOhms
3.34 A
- 55 C
+ 125 C
Standard
2 mm
1.6 mm
1.2 mm
Ferrite
IHHP-0806AB-01
Reel
Cut Tape
MouseReel
應用: High Current
品牌: Vishay / Dale
外殼代碼 - in: 0806
外殼代碼 - mm: 2016
核心類型: Wirewound
安裝風格: PCB Mount
產品: Power Inductors
產品類型: Power Inductors - SMD
原廠包裝數量: 2000
子類別: Inductors, Chokes & Coils
終端類型: SMD/SMT
試驗頻率: 100 kHz
每件重量: 53.130 mg
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
KRHTS:
8504509090
TARIC:
8504500090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

Vishay / Dale IHHP Low-Profile, High-Current Power Inductors

Vishay / Dale IHHP low-profile, high-current power inductors feature powdered iron cores for high saturation current up to 5.8A. Vishay / Dale IHHP series inductors are offered in miniature 2.0mm by 1.6mm 0806 and 2.5mm by 2.0mm 1008 case sizes, each available with low profiles of 1.0mm and 1.2mm. The series features high efficiency with maximum DC resistance (DCR) down to 15mΩ and a wide range of inductance values from 0.22µH to 10µH. IHHP devices provide heat rating current up to 5.3A and operate over a temperature range from -55°C to +125°C. These magnetic-alloy power inductors offer low acoustic noise and provide magnetic shielding to prevent interference with nearby components. IHHP inductors are optimized for DC/DC converters and power supply modules in notebook PCs, mobile phones, hard disk drives, SSDs, DVCs, and DSCs.
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