CLA-T264-21E

Name: Ohmite CLA-T264-21E
Brand: Ohmite
SKU: 588-CLA-T264-21E
Price: 19.65 HKD
Availability: InStock

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請參閱產品規格

Mouser 編號：

588-CLA-T264-21E

製造商編號：

CLA-T264-21E

製造商：

Ohmite

說明：

散熱器 CLIP FOR TO-264

規格書:

CLA-T264-21E 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Ohmite CLA-T264-21E的資訊

庫存量: 5,148

庫存：: 5,148 可立即送貨

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 23 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$19.65	HK$19.65
	HK$19.23	HK$192.30
	HK$18.99	HK$474.75
	HK$16.36	HK$1,636.00
	HK$11.26	HK$28,150.00
	HK$10.93	HK$54,650.00

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商品屬性	屬性值	選擇屬性
製造商:	Ohmite
產品類型:	散熱器
RoHS:
產品:	Accessories and Hardware
設計目的:	TO-264
安裝風格:	Clip
長度:	35.3 mm
寬度:	20.2 mm
高度:	11 mm
品牌:	Ohmite
封裝:	Bulk
產品類型:	Heat Sinks
系列:	CLA-21E
原廠包裝數量:	5000
子類別:	Heat Sinks
類型:	Component
每件重量:	71 g

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篩選文檔:

規格書

CLA-T264-21E 規格書 (PDF)

Application Notes

Resistor Selection (PDF)

RoHS Certificate (PDF)

CNHTS:: 8548000090
USHTS:: 8541900080
TARIC:: 7326909890
ECCN:: EAR99

Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

C40 Heat Sink System

Ohmite C40 Series Heat Sink System offers flexible, high performance, and compact heat sinks with an exchangeable cam clip system for TO-247, TO-264, and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole soldered in single or paired configurations. The paired unit has mounting holes to accommodate a 40mm x 40mm fan. Ideal applications for Ohmite C40 Series Heat Sink System include high power density and small size (1U or 2U) electronic packaging with forced convection.