BM22L-6P-V(53)

Hirose Connector
798-BM22L-6P-V(53)
BM22L-6P-V(53)

製造商:

說明:
板對板及夾層連接器 MICRO HYB B2FPC STR SMT HDR 6C GLD PLTD

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 182

庫存:
182 可立即送貨
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
包裝:
完整捲(訂購多個1000)

Pricing (HKD)

數量 單價
總價
零卷 / MouseReel™
HK$9.62 HK$9.62
HK$8.14 HK$81.40
HK$7.58 HK$189.50
HK$7.22 HK$722.00
HK$6.64 HK$1,660.00
HK$5.98 HK$2,990.00
完整捲(訂購多個1000)
HK$5.31 HK$5,310.00
HK$4.92 HK$9,840.00
HK$4.64 HK$23,200.00
† HK$55.00 MouseReel™費用將加入您的購物車內並自動計算。所有MouseReel™訂單均不能取消和不能退換。

商品屬性 屬性值 選擇屬性
Hirose Electric
產品類型: 板對板及夾層連接器
RoHS:  
Headers
6 Position
Solder
Straight
4 A, 300 mA
30 V
- 35 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
BM22
Reel
Cut Tape
MouseReel
品牌: Hirose Connector
組裝國家: Not Available
擴散國: Not Available
原產國: JP
絕緣電阻: 50 MOhms
產品類型: Board to Board & Mezzanine Connectors
原廠包裝數量: 1000
子類別: Board to Board & Mezzanine Connectors
零件號別名: 677-1007-0-53
每件重量: 8 mg
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所選屬性: 0

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CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

BM22 Micro-Hybrid Board-to-FPC Connectors

Hirose Electric BM22 Micro-Hybrid Board-to-FPC Connectors are capable of delivering nearly three times the power of similar-sized conventional connectors. The BM22 is available in either four-position (2 power + 2 signal) or six position (2 power + 4 signal) models. These micro-hybrid connectors are polarized to prevent mismating with the lead-in angle contributing to its smooth mating structure. Additionally, the Hirose BM22 features a high retention force with a locking feature on the power contacts, and guidance ribs which deliver a self-aligning range of 0.3mm and do not require any special adjustments. The 4-position BM22 series connectors measure just 4.24mm x 2.64mm and have a mated height of only 0.9mm. Tiny size and high current capacity make the Hirose BM22 Board-to-FPC Connectors an ideal choice for design engineers who need to optimize power transmissions while minimizing their PCB footprint.