ATS-59000-C1-R0

Name: Advanced Thermal Solutions ATS-59000-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59000-C1-R0
Price: 283.18 HKD
Availability: OutOfStock

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Mouser 編號：

984-ATS-59000-C1-R0

製造商編號：

ATS-59000-C1-R0

製造商：

Advanced Thermal Solutions

說明：

散熱器 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 21x45x9mm

規格書:

ATS-59000-C1-R0 規格書 (PDF)

ECAD模型:

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商品屬性	屬性值	選擇屬性
製造商:	Advanced Thermal Solutions
產品類型:	散熱器
RoHS:
產品:	Heat Sink Assemblies
設計目的:	BGA
安裝風格:	Snap On
吸熱材料:	Aluminum
散熱片類型:	Angled Fin
熱敏電阻:	6.1 C/W
長度:	45 mm
寬度:	21 mm
高度:	9 mm
品牌:	Advanced Thermal Solutions
色彩:	Black
封裝:	Bulk
產品類型:	Heat Sinks
系列:	maxiGRIP HS ASM - Custom
原廠包裝數量:	100
子類別:	Heat Sinks
公司名稱:	maxiFLOW maxiGRIP
類型:	Component

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所選屬性: 0

篩選文檔:

規格書

ATS-59000-C1-R0 規格書 (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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合規守則

CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

原產地分類

原產國:: 中國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.