9713-4X10

Name: 3M 9713-4X10
Brand: 3M Electronic Specialty
SKU: 517-9713-4X10
Price: 1026.68 HKD
Availability: InStock

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Mouser 編號：

517-9713-4X10

製造商編號：

9713-4X10

製造商：

3M Electronic Specialty

說明：

膠帶 XYZ-Axis Electrically Conductive Tape 4 in x 10yds Roll

規格書:

9713-4X10 規格書 (PDF)

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庫存量: 32

庫存：: 32 可立即送貨

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工廠前置作業時間：: 12 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

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Pricing (HKD)

數量	單價	總價
	HK$1,026.68	HK$1,026.68

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商品屬性	屬性值	選擇屬性
製造商:	3M
產品類型:	膠帶
RoHS:
產品:	Tapes
類型:	Conductive
描述/功能:	XYZ-Axis Electrically Conductive Tape is an Isotropically Conductive Pressure Sensitive Tape
膠合劑類型:	Acrylic
寬度 – 英吋:	4 in
寬度 – 毫米:	101.6 mm
長度 – 英吋:	10 yd
長度 – 毫米:	9.14 m
品牌:	3M Electronic Specialty
產品類型:	Tape
系列:	9713
原廠包裝數量:	6
子類別:	Supplies
厚度:	0.0889 mm
零件號別名:	7000048874
每件重量:	622 g

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篩選文檔:

規格書

9713-4X10 規格書 (PDF)

USHTS:: 3506911000
ECCN:: EAR99

Conductive Adhesive 9712 & 9713 Transfer Tape

3M Electronic Specialty Conductive Adhesive 9712 and 9713 Transfer Tape offers XYZ-axis-based conductivity in various conductive adhesives, carriers, and fillers, providing enhanced EMI performance. This tape features an adhesive that is coated directly to the liners for a more conformable and flexible double-sided tape that provides a conductive carbon scrim carrier. The tape is available in multiple thicknesses and offers EMI/RFI shielding and grounding across multiple frequencies. 3M Electronic Specialty 9712 and 9713 series tape is designed for EMI shielding and ground applications, enabling devices to meet electromagnetic compatibility requirements.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.