GPHC5.0-0.060-02-0816

Bergquist Company
951-GPHC5.0-6002-816
GPHC5.0-0.060-02-0816

製造商：

說明：
熱介面產品 GAP PAD, S-Class, 8"x16" Sheet, 0.060" Thickness, TGPHC5000/HC 5.0, IDH 2195378

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庫存量: 163

庫存：
163 可立即送貨
工廠前置作業時間：
5 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$930.67 HK$930.67
HK$849.03 HK$8,490.30
HK$818.24 HK$81,824.00
500 報價

商品屬性 屬性值 選擇屬性
Bergquist Company
產品類型: 熱介面產品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone
5 W/m-K
5 kVAC
Gray
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
17.5 psi
UL 94 V-0
HC 5.0 / TGP HC5000
品牌: Bergquist Company
設計目的: Telecommunications, ASICs/DSPs, Consumer Electronics, Thermal Modules or Heat Sinks
產品類型: Thermal Interface Products
大小: 8 in x 16 in
原廠包裝數量: 1
子類別: Thermal Management
公司名稱: GAP PAD
零件號別名: L8INW16INH0.06 PN0008397 2195378
每件重量: 439 g
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所選屬性: 0

CNHTS:
8541900000
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
TARIC:
8541900000
MXHTS:
3919909900
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

數據中心應用

Bergquist Company數據中心應用採用先進材料，有助於熱管理、長期可靠性和應力保護。隨著分析、人工智能 (AI) 和高性能運算成為主流，數據中心的速度和容量也在不斷增長。需求的增加促使下一代數據中心的運作溫度升高，而這種熱量會降低效能。Bergquist Company設計和製造組件級熱管理以及應力保護產品，有助於滿足該等更高的效能要求。

路由器交換機和網絡應用

Bergquist Company路由器交換機和網絡應用包括相變材料和導熱黏合劑，旨在將熱敏感組件的熱量散發出去。在伺服器主機板以及路由器和交換機線路卡中使用先進材料，可帶來規模擴大和成本降低等好處。效能的小幅提升，重複數千次，會對路由器和切換的效能產生顯著影響。Bergquist Company的散熱產品可協助組件正常運作，達至最佳運作狀態。

儲存應用

Bergquist Company儲存應用程式採用先進的儲存硬件材料，提供了可靠性、穩定性和傳輸速率。每次提升可靠性和性能都會降低成本，同時滿足用戶不斷增長的期望。Bergquist Company的熱管理材料包括多種產品類型，可滿足各種應用需求。

伺服器應用

Bergquist Company伺服器應用程式採用熱管理產品的用途廣泛 — 從機櫃中的幾台伺服器到資料中心中的幾千台伺服器均可使用。無論伺服器數量有多少，熱量的輕微減少或組件性能的提高都會明顯影響基礎設施的運作。Bergquist Company提供用於整個電路板的先進材料，有助於優化效能和相應的網絡。

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

5G Products

Bergquist 5G Products are designed to meet the demanding conditions required for 5G telecom infrastructure components. These highly stable interconnect materials provide fundamental electrical functions for dependable telecom infrastructure performance, ensuring reliable, long-term performance. The Bergquist 5G portfolio features multiple formats, including pads, gels, liquids, and adhesives, to maximize system reliability.

TGP HC5000 Highly Conformable GAP PAD®

Bergquist Company TGP HC5000 Highly Conformable GAP PAD® is a silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with a clear PET liner with reduced tack on one side and Blue Diamond liner. Bergquist Company TGP HC5000 Highly Conformable GAP PAD is easily reworkable.

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