說明：

熱介面產品 FULLAXS EMI BULKHEAD ASSEMBLY

Pricing (HKD)

數量	單價	總價
	HK$1,275.09	HK$1,275.09
	HK$1,061.70	HK$57,331.80
102	報價

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商品屬性	屬性值	選擇屬性
製造商:	3M
產品類型:	熱介面產品
RoHS:
產品:	Thermally Conductive Adhesive Tape
類型:	Thermally Conductive Tape
封裝/外殼:	Non-standard
材料:	Acrylic
熱導率:	0.60 W/m-K
色彩:	White
最高工作溫度:	+ 70 C
寬度:	101.6 mm
厚度:	0.25 mm
易燃性等級:	UL 74 6-C
系列:	8810
品牌:	3M Electronic Specialty
產品類型:	Thermal Interface Products
原廠包裝數量:	6
子類別:	Thermal Management
零件號別名:	7000050172
每件重量:	2.017 kg

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所選屬性: 0

篩選文檔:

規格書

8810-4X10 規格書 (PDF)

USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.