HPC/cALP-CSP-HP-B
製造商:
說明:
CPU和晶片散熱器 Standard passive cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 28.2mm height. All standoffs are with 2.7mm bore hole.
供貨情況
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庫存:
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暫無庫存發生意外錯誤了。請稍後再試。
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工廠前置作業時間:
Pricing (HKD)
| 數量 | 單價 |
總價
|
|---|---|---|
| HK$617.08 | HK$617.08 | |
| HK$555.18 | HK$5,551.80 | |
| HK$518.68 | HK$12,967.00 | |
| HK$511.45 | HK$25,572.50 | |
| HK$511.28 | HK$51,128.00 | |
| 500 | 報價 |
香港
