MDP14031M00GD04

Vishay / Dale
71-MDP1403-1M
MDP14031M00GD04

製造商:

說明:
電阻器網路及陣列 14pin 1Mohms 2% I Isolated

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
暫無庫存
工廠前置作業時間:
12 週 工廠預計生產時間。
最少: 1000   多個: 25
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$28.28 HK$28,280.00
HK$27.87 HK$69,675.00

類似產品

商品屬性 屬性值 選擇屬性
Vishay
產品類型: 電阻器網路及陣列
RoHS: N
Tube
MDP
Networks
DIP
1 MOhms
2 %
Isolated
7 Resistor
14 Pin
100 PPM / C
- 55 C
+ 125 C
DIP-14
19.05 mm
7.87 mm
3.05 mm
品牌: Vishay / Dale
引線間距: 2.54 mm
每一元件的功率: 0.25 W (1/4 W)
產品類型: Resistor Networks & Arrays
原廠包裝數量: 25
子類別: Resistors
每件重量: 1.300 g
找到產品:
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至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

                        
VISHAY DALE MOLDED NETWORKS: MSP, MSM, MDP, SOMC, MDM, SOGC

VISHAY is in the process of qualifying a new Mold Compound
on all Molded Network Resistors. This includes all
custom parts (dash numbers).

This change allows for a second source and updates to a
newer, more available, compound that provides the latest
technology in molding material.

The material change will include a color change from gold
to black.

Please check with a Mouser Sales Representative for more
information.



5-0505-78

CNHTS:
8533211000
CAHTS:
8533210000
USHTS:
8533210060
JPHTS:
853321000
KRHTS:
8533219000
TARIC:
8533210000
MXHTS:
8533210100
BRHTS:
85332190
ECCN:
EAR99

MDP Dual-In-Line Thick Film Resistor Networks

Vishay / Dale MDP 01, 03, and 05 Dual-In-Line Thick Film Resistor Networks offer a maximum seated height of 0.160" (4.06mm) and rugged, molded case construction. These resistor networks provide a low ±100ppm/°C temperature coefficient in a -55°C to +125°C temperature range. The series features thick film resistive elements, uniform performance characteristics, and a wide 10Ω to 2.2MΩ resistance range. Isolated, bused, and dual terminator schematics are available. Vishay / Dale MDP 01, 03, 05 Dual-In-Line Thick Film Resistor Networks are compatible with automatic inserting equipment and available in a tube pack. The MDP series is designed to help reduce total assembly costs.