MSP430F6779IPZ

Texas Instruments
595-MSP430F6779IPZ
MSP430F6779IPZ

製造商：

說明：
計量系統單晶片 - SoC Mixed Signal MCU A 5 95-MSP430F6779IPZR A 595-MSP430F6779IPZR

規格書:
ECAD模型:
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庫存量: 12

庫存：
12 可立即送貨
工廠前置作業時間：
18 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$158.73 HK$158.73
HK$118.94 HK$1,189.40
HK$118.78 HK$2,969.50
HK$108.34 HK$9,750.60
HK$104.48 HK$28,209.60
HK$102.59 HK$46,165.50
HK$101.68 HK$91,512.00
2,700 報價

備用包裝

製造商 元件編號:
MSP430F6779IPZR
包裝:
Reel, Cut Tape, MouseReel
供貨情況:
庫存量
價格:
HK$127.99
最小值:
1

相似產品

Texas Instruments MSP430F6779IPZR
Texas Instruments
計量系統單晶片 - SoC Mixed Signal MCU A 5 95-MSP430F6779IPZ A A 595-MSP430F6779IPZ
與當前零件比較

商品屬性 屬性值 選擇屬性
Texas Instruments
產品類型: 計量系統單晶片 - SoC
RoHS:  
CPUXV2
25 MHz
32 kB
10 bit, 24 bit
LQFP-100
62 I/O
16 bit
512 kB
I2C, SPI, UART
1.8 V to 3.6 V
MSP430F6779
Tray
品牌: Texas Instruments
數據存儲器類型: SRAM
最高工作溫度: + 85 C
最低工作溫度: - 40 C
濕度敏感: Yes
安裝風格: SMD/SMT
定時器/計數器數目: 4 x 16 bit
處理器系列: MSP430
產品類型: SOC - Metering Systems on a Chip
程序存儲器類型: Flash
原廠包裝數量: 90
子類別: SOC - Systems on a Chip
公司名稱: MSP430
每件重量: 1.319 g
找到產品:
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所選屬性: 0

此功能需要啟用JavaScript。

CNHTS:
8542319090
CAHTS:
8542310000
USHTS:
8542310070
JPHTS:
854231032
KRHTS:
8542311000
TARIC:
8542319000
MXHTS:
8542310302
ECCN:
5A992.C

MSP430F6xx Series

Texas Instruments MSP430F6xx Series 16-bit MCUs feature low active power consumption with integrated USB connectivity and an LCD controller. The MSP430F6xx ultra-low-power MCUs provide designers with enhanced performance and increased design options with innovative peripherals on a chip that have more memory and integrated capabilities while using less power than ever before. The TI MSP430 ultralow power MCU family consists of several devices featuring different sets of peripherals targeted for various applications.

Processors

Texas Instruments Processors provide a comprehensive portfolio, proven software, and worldwide support, enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance, and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

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