HPTT-3-S-6-6-D-RA

Samtec
200-HPTT3S66DRA
HPTT-3-S-6-6-D-RA

製造商:

說明:
高速/模組連接器 XCede HD Power Module

壽命週期:
新產品:
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庫存量: 53

庫存:
53 可立即送貨
工廠前置作業時間:
2 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$105.05 HK$105.05
HK$100.86 HK$2,521.50
HK$96.83 HK$5,325.65
HK$90.01 HK$9,901.10
HK$77.43 HK$21,293.25
HK$65.84 HK$36,212.00
HK$54.50 HK$56,952.50
2,530 報價

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Power Modules
12 Position
2 Row
1.5 mm
Press-Fit
Gold
HPTT
Tray
品牌: Samtec
觸點材料: Copper Alloy
外殼顏色: Black
外殼材料: Polyphenylene Sulfide (PPS)
裝配角: Right Angle
定位: Right Angle
產品類型: High Speed / Modular Connectors
原廠包裝數量: 55
子類別: Backplane Connectors
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USHTS:
8536694040
ECCN:
EAR99

HPTT XCede® HD Power Modules

Samtec HPTT XCede® HD Power Modules offer a 1.8mm pitch and a small form factor for significant space savings. These modules are a high-performance system with up to 84 differential pairs per linear inch. HPTT XCede modules allow users to combine any configuration of modules to create one integrated receptacle. Specifications for the HPTT XCede Modules from Samtec include 85Ω and 100Ω options, copper alloy contact material, 10A current rating per blade, and an operating temperature range of -40°C to +105°C. Samtec HPTT XCede HD Power Modules mate with the HPTS series and offer 3-, 4-, and 6-pair designs on 4, 6, and 8 columns.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.