HDTM-4-08-2-S-VT-0-3

Samtec
200-HDTM4082SVT03
HDTM-4-08-2-S-VT-0-3

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

壽命週期:
新產品:
該製造商的新產品。
ECAD模型:
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供貨情況

庫存:
暫無庫存
工廠前置作業時間:
6 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$99.54 HK$99.54
HK$89.76 HK$897.60
HK$79.98 HK$1,999.50
HK$65.27 HK$3,263.50
HK$56.64 HK$5,664.00
HK$51.54 HK$25,976.16
HK$44.72 HK$45,077.76
HK$37.98 HK$76,567.68

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Headers
64 Position
8 Row
1.8 mm
Solder Pin
Tray
品牌: Samtec
觸點材料: Phosphor Bronze
额定电流: 1.5 A
外殼材料: Liquid Crystal Polyer (LCP)
最高工作溫度: + 105 C
最低工作溫度: - 40 C
裝配角: Vertical
定位: Straight
產品類型: High Speed / Modular Connectors
原廠包裝數量: 63
子類別: Backplane Connectors
額定電壓: 48 VAC
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所選屬性: 0

USHTS:
8536694040
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.