HDTM-4-08-1-S-VT-0-2

Samtec
200-HDTM4081SVT02
HDTM-4-08-1-S-VT-0-2

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 63

庫存:
63 可立即送貨
工廠前置作業時間:
2 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$98.06 HK$98.06
HK$88.45 HK$884.50
HK$78.75 HK$1,968.75
HK$64.28 HK$3,214.00
HK$55.90 HK$5,590.00
HK$50.88 HK$25,643.52
HK$44.22 HK$44,573.76
HK$37.40 HK$75,398.40

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Tray
品牌: Samtec
產品類型: High Speed / Modular Connectors
原廠包裝數量: 63
子類別: Backplane Connectors
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.