HDTM-3-08-2-S-VT-5-R-3

Samtec
200-HDTM3082SVT5R3
HDTM-3-08-2-S-VT-5-R-3

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

壽命週期:
新產品:
該製造商的新產品。
ECAD模型:
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供貨情況

庫存:
暫無庫存
工廠前置作業時間:
3 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$101.35 HK$101.35
HK$91.32 HK$913.20
HK$81.38 HK$2,034.50
HK$66.50 HK$5,586.00
HK$59.43 HK$14,976.36
HK$54.83 HK$27,634.32
HK$48.91 HK$49,301.28
HK$43.16 HK$87,010.56

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Headers
48 Position
8 Row
1.8 mm
Solder Pin
Tray
品牌: Samtec
觸點材料: Phosphor Bronze
额定电流: 1.5 A
外殼材料: Liquid Crystal Polyer (LCP)
最高工作溫度: + 105 C
最低工作溫度: - 40 C
裝配角: Vertical
定位: Straight
產品類型: High Speed / Modular Connectors
原廠包裝數量: 42
子類別: Backplane Connectors
額定電壓: 48 VAC
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所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.