HDTM-3-08-2-S-VT-2-1

Samtec
200-HDTM3082SVT21
HDTM-3-08-2-S-VT-2-1

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
暫無庫存
工廠前置作業時間:
3 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$84.83 HK$84.83
HK$76.53 HK$765.30
HK$68.14 HK$1,703.50
HK$55.65 HK$3,005.10
HK$48.33 HK$5,219.64
HK$43.98 HK$23,749.20
HK$38.14 HK$39,131.64
HK$32.39 HK$66,464.28

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Tray
品牌: Samtec
組裝國家: Not Available
擴散國: Not Available
原產國: US
產品類型: High Speed / Modular Connectors
原廠包裝數量: 54
子類別: Backplane Connectors
找到產品:
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所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.