HDTM-3-06-1-S-VT-5-R-2

Samtec
200-HDTM3061SVT5R2
HDTM-3-06-1-S-VT-5-R-2

製造商：

說明：
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

規格書:
ECAD模型:
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庫存量: 38

庫存：
38 可立即送貨
工廠前置作業時間：
1 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$85.57 HK$85.57
HK$77.19 HK$771.90
HK$68.72 HK$1,718.00
HK$56.14 HK$5,389.44
HK$50.39 HK$14,512.32
HK$46.61 HK$24,610.08
HK$41.84 HK$42,174.72
HK$37.07 HK$74,733.12

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
RoHS:  
Headers
36 Position
6 Row
1.8 mm
Press Fit
Gold
Tray
品牌: Samtec
產品類型: High Speed / Modular Connectors
原廠包裝數量: 48
子類別: Backplane Connectors
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所選屬性: 0

規格書

Images

Specification Sheets

Technical Resources

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

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