HDTM-3-06-1-S-VT-5-R-1

Samtec
200-HDTM3061SVT5R1
HDTM-3-06-1-S-VT-5-R-1

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
暫無庫存
工廠前置作業時間:
2 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$88.53 HK$88.53
HK$79.90 HK$799.00
HK$71.10 HK$1,777.50
HK$58.12 HK$5,579.52
HK$52.11 HK$15,007.68
HK$48.17 HK$25,433.76
HK$43.24 HK$43,585.92
HK$38.22 HK$77,051.52

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
Tray
品牌: Samtec
產品類型: High Speed / Modular Connectors
原廠包裝數量: 48
子類別: Backplane Connectors
找到產品:
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所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.