HDTF-3-06-S-RA-HS-100

Samtec
200-HDTF-306SRAHS100
HDTF-3-06-S-RA-HS-100

製造商:

說明:
高速/模組連接器 XCede(R) HD 1.80 mm High-Density Backplane Right-Angle Receptacle

ECAD模型:
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供貨情況

庫存:
暫無庫存
工廠前置作業時間:
6 週 工廠預計生產時間。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$127.82 HK$127.82
HK$115.24 HK$1,152.40
HK$102.67 HK$2,566.75
HK$83.84 HK$7,042.56
HK$66.25 HK$33,390.00
HK$57.46 HK$57,919.68
5,040 報價

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 高速/模組連接器
RoHS:  
Receptacles
6 Row
1.8 mm
Solder Pin
Gold
HDTF
Tray
品牌: Samtec
觸點材料: Copper Alloy
外殼顏色: Black
外殼材料: Liquid Crystal Polymer (LCP)
最高工作溫度: + 105 C
最低工作溫度: - 40 C
裝配角: Right Angle
產品類型: High Speed / Modular Connectors
原廠包裝數量: 42
子類別: Backplane Connectors
公司名稱: XCede
找到產品:
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所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD HDTF Right-Angle Backplane Receptacles

Samtec XCede® HD HDTF Right-Angle 1.8mm Backplane Receptacles feature a 1.8mm column pitch, 84 differential pairs per inch, and a modular design for application flexibility. These Samtec receptacles are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. The HDTF backplane receptacles are built with liquid crystal polymer (LCP) housing and copper alloy contact material. These receptacles are RoHS compliant and operate at -40°C to +105°C temperature range. XCede HD HDTF backplane receptacles mate with the XCede HD HDTM vertical backplane headers.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.