EBTF-6-08-2.0-S-RA-1-L

Name: Samtec EBTF-6-08-2.0-S-RA-1-L
Brand: Samtec
SKU: 200-EBTF-6082.0SRA1L
Price: 271.34 HKD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-EBTF-6082.0SRA1L

製造商編號：

EBTF-6-08-2.0-S-RA-1-L

製造商：

Samtec

說明：

高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Right-Angle Receptacle

規格書:

EBTF-6-08-2.0-S-RA-1-L 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Samtec EBTF-6-08-2.0-S-RA-1-L的資訊

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庫存：: 發生意外錯誤了。請稍後再試。

180 可於 20 天後送貨

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$271.34	HK$271.34
	HK$247.92	HK$2,479.20
	HK$226.54	HK$5,663.50
	HK$207.06	HK$10,353.00
	HK$187.83	HK$18,783.00
	HK$172.78	HK$43,195.00
	HK$158.97	HK$79,485.00
1,000	報價

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	高速/模組連接器
RoHS:
產品:	Receptacles
定位數:	96 Position
排數:	8 Row
間距:	2 mm
終端類型:	Solder Pin
觸點电镀:	Gold
系列:	EBTF
封裝:	Bulk
品牌:	Samtec
觸點材料:	Copper Alloy
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
额定电流:	4.2 A
外殼顏色:	Black
外殼材料:	Liquid Crystal Polymer (LCP)
最高工作溫度:	+ 105 C
最低工作溫度:	- 55 C
裝配角:	Right Angle
產品類型:	High Speed / Modular Connectors
原廠包裝數量:	1
子類別:	Backplane Connectors
公司名稱:	ExaMAX

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所選屬性: 0

篩選文檔:

規格書

EBTF-6-08-2.0-S-RA-1-L 規格書 (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.