ASP-209946-01

Samtec
200-ASP-209946-01
ASP-209946-01

製造商:

說明:
板對板及夾層連接器

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 604

庫存:
604 可立即送貨
工廠前置作業時間:
2 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$197.61 HK$197.61
完整捲(訂購多個500)
HK$179.03 HK$89,515.00
1,000 報價

商品屬性 屬性值 選擇屬性
Samtec
產品類型: 板對板及夾層連接器
RoHS:  
Connectors
ASP
Reel
Cut Tape
品牌: Samtec
產品類型: Board to Board & Mezzanine Connectors
原廠包裝數量: 500
子類別: Board to Board & Mezzanine Connectors
公司名稱: SEARAY
找到產品:
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至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

Industry Standards Solution

Samtec's Industry Standards Solution improves compatibility, performance, and efficiency. Samtec provides connector products that interact with many types of hardware and software. This drives the need to adhere to a variety of Industry Standards.

COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.