LPS33KTR

STMicroelectronics
511-LPS33KTR
LPS33KTR

製造商：

說明：
板機接口壓力傳感器 MEMS pressure sensor: 300-1200 hPa absolute digital output barometer with potted
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庫存量: 1,076

庫存：
1,076 可立即送貨
工廠前置作業時間：
18 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
包裝:
完整捲（訂購多個2500）

Pricing (HKD)

數量 單價
總價
零卷 / MouseReel™ †
HK$33.78 HK$33.78
HK$30.25 HK$151.25
HK$28.93 HK$289.30
HK$27.37 HK$684.25
HK$26.30 HK$1,315.00
HK$25.32 HK$2,532.00
HK$23.34 HK$11,670.00
HK$22.61 HK$22,610.00
完整捲（訂購多個2500）
HK$21.54 HK$53,850.00
† HK$55.00 MouseReel™費用將加入您的購物車內並自動計算。所有MouseReel™訂單均不能取消和不能退換。 ↩

商品屬性 屬性值 選擇屬性
STMicroelectronics
產品類型: 板機接口壓力傳感器
RoHS:  
Absolute
26 kPa to 126 kPa
100 Pa
Digital
SMD/SMT
I2C, SPI
1.7 V to 3.6 V
No Port
24 bit
3.3 mm x 3.3 mm x 2.9 mm
- 40 C
+ 85 C
Reel
Cut Tape
MouseReel
品牌: STMicroelectronics
濕度敏感: Yes
產品類型: Board Mount Pressure Sensors
原廠包裝數量: 2500
子類別: Sensors
電源電壓 - 最大值: 3.6 V
電源電壓 - 最小值: 1.7 V
零件號別名: LPS33K
每件重量: 1.430 g
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所選屬性: 0

CNHTS:
8542391090
USHTS:
8542390090
TARIC:
9026208090
ECCN:
EAR99

LPS33K MEMS Pressure Sensor

STMicroelectronics LPS33K MEMS Pressure Sensor combines a sensing element based on a piezoresistive Wheatstone bridge approach with an I2C interface in a single compact package. The sensing element detects absolute pressure and consists of a suspended silicon membrane. When pressure is applied, the membrane deflection induces an imbalance in the Wheatstone bridge, and the output signal is converted by the IC interface. The LPS33K features a data-ready signal that indicates when a new set of measured pressure and temperature data is available, simplifying data synchronization in the digital system that uses the device. STMicroelectronics LPS33K MEMS Pressure Sensor is available in a ceramic LGA package with a metal lid. The package is holed to allow external pressure to reach the sensing element, while the gel inside the IC protects the electrical components from harsh environments.

MEMS Pressure Sensors

STMicroelectronics MEMS Pressure Sensors use innovative MEMS technology to provide extremely high-pressure resolution, in ultra-compact and thin packages. The devices are designed using ST's VENSENS technology, allowing the fabrication of pressure sensors on a monolithic silicon chip. This eliminates wafer-to-wafer bonding and maximizes reliability.

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