172501-8002

Molex
538-172501-8002
172501-8002

製造商：

說明：
I/O 連接器 zSFP+ Stkd 2x8 Assy w/Improved Airflow

規格書:
ECAD模型:
下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。
更多資訊
瞭解更多關於Molex 172501-8002的資訊

供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 32   多個： 16
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$1,154.91 HK$36,957.12
HK$1,138.63 HK$54,654.24
112 報價

商品屬性 屬性值 選擇屬性
Molex
產品類型: I/O 連接器
RoHS:  
Connectors
Jack (Female)
320 Position
0.8 mm
30 V
Gold
Press Fit
Through Hole
Right Angle
172501
- 40 C
+ 85 C
Tray
品牌: Molex
色彩: Black
觸點材料: Copper Alloy
組裝國家: Not Available
擴散國: Not Available
原產國: ID
额定电流: 500 mA
外殼材料: Thermoplastic (TP)
端口數: 16 Port
產品類型: I/O Connectors
原廠包裝數量: 16
子類別: I/O Connectors
公司名稱: zSFP+
類型: zSFP+
零件號別名: 1725018002 01725018002
每件重量: 153.860 g
找到產品:
若要顯示類似商品，請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

zSFP+ 2-by-1 Stacked Integrated Cages

Molex zSFP+ 2-by-1 Stacked Integrated Cages offer superior signal integrity (SI), mechanical and electrical performance, and reduced resonance. The cages support current 10Gbps Ethernet and 16Gbps Fibre Channel applications and 25Gbps data-rate requirements. The cages feature a next-generation terminal and host footprint design and offer compact space savings and ease of processing in press-fit applications. Molex zSFP+ 2-by-1 Stacked Integrated Cages feature a low-profile metal-finger version allowing for tighter cage-to-cage pitch and a height is slightly lower than the standard version.

資料/運算解決方案

Molex資料/運算解決方案可流暢整合伺服器、工作站、網路硬體與儲存裝置。Molex資料與運算解決方案採用快速、精巧且高效率的設計，具有優異的訊號完整度，能滿足目前技術的高速與高密度需求。此系列提供的解決方案還包含纜線組件、連接器、軟性扁線、功率連接器、多光纖解決方案等。Molex資料/運算解決方案系列適用於從物聯網到傳統網路效能等各種應用。

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).

發生意外的錯誤。


有問題嗎？ 請瀏覽幫助中心。
有關特定訂單的問題，請登入您的帳戶。

如有其他問題，請致電800-346-6873或發送郵件至 help@mouser.com 與我們聯絡。