170814-2009

Molex
538-170814-2009
170814-2009

製造商：

說明：
板對板及夾層連接器 NeoScale Recpt 2.8mm 6x20 Gld 8mm Hght

規格書:
ECAD模型:
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供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 240   多個： 80
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$1,080.93 HK$259,423.20
320 報價

商品屬性 屬性值 選擇屬性
Molex
產品類型: 板對板及夾層連接器
RoHS:  
Connectors
360 Position
2.8 mm (0.11 in)
6 Row
Vertical
1 A
30 VAC
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
170814
Tray
品牌: Molex
易燃性等級: UL 94 V-0
安裝風格: Cable
產品類型: Board to Board & Mezzanine Connectors
原廠包裝數量: 16
子類別: Board to Board & Mezzanine Connectors
公司名稱: NeoScale
零件號別名: 1708142009 01708142009
每件重量: 16.426 g
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所選屬性: 0

規格書

Models

Specification Sheets

CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

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