A18909-06

Laird Technologies
739-A18909-06
A18909-06

製造商:

說明:
熱介面產品 Thickness 1.50mm 229x229mm Grey

壽命週期:
新產品:
該製造商的新產品。
ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
0

您仍可購買此商品作為延期交貨訂單。

在途量:
10
預期25/1/2027
工廠前置作業時間:
4
工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$1,669.48 HK$1,669.48
HK$1,513.38 HK$15,133.80

商品屬性 屬性值 選擇屬性
Laird Technologies
產品類型: 熱介面產品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Ceramic Filled Silicone
6.2 W/mK
7 kV
Gray
- 50 C
+ 150 C
229 mm
229 mm
1.5 mm
UL 94 V-0
HR6.5
Bulk
品牌: Laird Technologies
產品類型: Thermal Interface Products
原廠包裝數量: 10
子類別: Thermal Management
公司名稱: Tflex
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

USHTS:
3919905060
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HR6.5 Thermal Gap Filler

Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is built to withstand cyclic gap changes due to shock, vibration, or warpage, providing consistent thermal performance over the part's life. HR6.5 material provides minimal stress on components, is easily assembled, and, in many cases, can be reused after rework due to its good rebound capability. Laird Technologies Tflex HR6.5 Thermal Gap Filler offers a 1mm to 5mm thickness range, ceramic-filled silicon sheet construction, a UL 94V-0 flammability rating, and a -50°C to +150°C operating temperature range.