C0603X154K3NACTU

KEMET
80-C0603X154K3NACTU
C0603X154K3NACTU

製造商:

說明:
多層陶瓷電容器MLCC - SMD/SMT 25V 0.15uF 0603 X8L 10%

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 4,331

庫存:
4,331 可立即送貨
工廠前置作業時間:
14 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
包裝:
完整捲(訂購多個4000)

Pricing (HKD)

數量 單價
總價
零卷 / MouseReel™
HK$5.01 HK$5.01
HK$2.33 HK$23.30
HK$2.06 HK$206.00
HK$1.66 HK$830.00
HK$1.52 HK$1,520.00
HK$1.41 HK$2,820.00
完整捲(訂購多個4000)
HK$1.25 HK$5,000.00
† HK$55.00 MouseReel™費用將加入您的購物車內並自動計算。所有MouseReel™訂單均不能取消和不能退換。

商品屬性 屬性值 選擇屬性
KEMET
產品類型: 多層陶瓷電容器MLCC - SMD/SMT
RoHS:  
0.15 uF
25 VDC
X8L
10 %
0603
1608
SMD/SMT
Flexible (Soft)
- 55 C
+ 150 C
1.6 mm (0.063 in)
0.8 mm (0.031 in)
0.8 mm (0.031 in)
General Type MLCCs
SMD Comm X8L HT150C
Reel
Cut Tape
MouseReel
品牌: KEMET
級別: Class 2
組裝國家: Not Available
擴散國: Not Available
原產國: MX
封裝/外殼: 0603 (1608 metric)
產品類型: Ceramic Capacitors
原廠包裝數量: 4000
子類別: Capacitors
類型: Surface Mount Multilayer Ceramic Chip Capacitor
零件號別名: C0603X154K3NAC7867
每件重量: 6.300 mg
找到產品:
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所選屬性: 0

CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
TARIC:
8532240000
MXHTS:
8532240400
BRHTS:
85322410
ECCN:
EAR99

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KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection. 

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