627-11W1224-1N1

EDAC
587-627-11W1224-1N1
627-11W1224-1N1

製造商:

說明:
D-Sub混合接觸連接器 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, PCB tails, nickel plated shell

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 250

庫存:
250 可立即送貨
工廠前置作業時間:
12 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$47.92 HK$47.92
HK$40.69 HK$406.90
HK$38.14 HK$953.50
HK$36.33 HK$1,816.50
HK$34.61 HK$3,461.00
HK$31.98 HK$7,995.00
HK$30.83 HK$15,415.00
HK$29.35 HK$29,350.00
HK$27.54 HK$68,850.00

商品屬性 屬性值 選擇屬性
EDAC
產品類型: D-Sub混合接觸連接器
REACH - SVHC:
11W1
11 Position
Through Hole
Vertical
Solder Cup
品牌: EDAC
觸點材料: Copper
觸點电镀: Gold
额定电流: 10 A
過濾: Unfiltered
性別: Male
絕緣: Insulated
絕緣材料: Thermoplastic Polyester
最高工作溫度: + 125 C
最低工作溫度: - 55 C
產品類型: Mixed Contact D-Sub Connectors
系列: 627
外殼質料: Steel
外殼板: Nickel
原廠包裝數量: 1
子類別: D-Sub Connectors
額定電壓: 125 V
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所選屬性: 0

USHTS:
8536694040
TARIC:
8536693000
ECCN:
EAR99

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.