14L-602-210-AA2

EDAC
587-14L-602-210-AA2
14L-602-210-AA2

製造商：

說明：
集管和線殼 14L Series (.156"(3.96mm) contact spacing) Inline 2 positions socket housing only

壽命週期:
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規格書:
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庫存量: 924

庫存：
924 可立即送貨
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$1.07 HK$1.07
HK$0.88 HK$8.80
HK$0.789 HK$19.73
HK$0.748 HK$74.80
HK$0.666 HK$166.50
HK$0.649 HK$649.00
HK$0.617 HK$1,851.00
HK$0.559 HK$2,795.00
HK$0.543 HK$5,430.00

商品屬性 屬性值 選擇屬性
EDAC
產品類型: 集管和線殼
RoHS:  
Wire Housings
Socket
2 Position
3.96 mm (0.156 in)
1 Row
Cable Mount / Free Hanging
Crimp
Straight
Gold
14L
Wire-to-Board
22 AWG to 18 AWG
- 25 C
+ 105 C
Bulk
品牌: EDAC
觸點材料: Phosphor Bronze
觸點類型: Socket
組裝國家: Not Available
擴散國: Not Available
原產國: CN
额定电流: 7 A
易燃性等級: UL 94 V-0
外殼顏色: Natural
插座類型: Female
外殼材料: Nylon
絕緣電阻: 1 GOhms
產品類型: Headers & Wire Housings
原廠包裝數量: 1000
子類別: Headers & Wire Housings
額定電壓: 250 VAC/DC
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所選屬性: 0

規格書

Test/Quality Data

此功能需要啟用JavaScript。

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

14L Series 3.96mm Inline Wire-to-Board Connectors

EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors feature a 3.96mm pitch, 7A current rating, and an operating temperature range of -25°C to +105°C. The insulator material has a UL 94V-0 flammability rating and top- or side-entry configurations. 14L series connectors accept 22AWG to 18AWG wires and offer a 1500VAC dielectric withstanding voltage, 1000MΩ insulation resistance, and 10mΩ maximum contact resistance. EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors are for use with PCB boards of 1.6mm nominal thicknesses.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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