140-510-415-100

EDAC
587-140-510-415-100
140-510-415-100

製造商:

說明:
集管和線殼 140 Series Wire to Board in-line 2.0mm pitch connector with 10 P.C. board through hole contacts, side entry

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 963

庫存:
963 可立即送貨
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$3.37 HK$3.37
HK$3.00 HK$30.00
HK$2.66 HK$66.50
HK$2.47 HK$247.00
HK$2.07 HK$517.50
HK$1.68 HK$1,680.00
HK$1.61 HK$4,025.00
HK$1.55 HK$15,500.00
HK$1.52 HK$30,400.00

商品屬性 屬性值 選擇屬性
EDAC
產品類型: 集管和線殼
RoHS:  
Headers
Shrouded
10 Position
2 mm (0.079 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Pin (Male)
Tin
140
Wire-to-Board
- 40 C
+ 105 C
品牌: EDAC
觸點材料: Brass
额定电流: 2 A
易燃性等級: UL 94 V-0
外殼顏色: Natural
外殼材料: Polyamide (PA)
絕緣電阻: 1 GOhms
產品類型: Headers & Wire Housings
原廠包裝數量: 1
子類別: Headers & Wire Housings
額定電壓: 100 V
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所選屬性: 0

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USHTS:
8536694040
ECCN:
EAR99

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.