470-3075-100

Amphenol TCS
523-470-3075-100
470-3075-100

製造商:

說明:
板對板及夾層連接器 300P NeXLev Recept 570 Solder Balls

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
暫無庫存
工廠前置作業時間:
最少: 20   多個: 20
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$381.33 HK$7,626.60
HK$368.58 HK$22,114.80
HK$348.28 HK$34,828.00
HK$348.20 HK$90,532.00

商品屬性 屬性值 選擇屬性
Amphenol
產品類型: 板對板及夾層連接器
RoHS:  
Receptacles
300 Position
1.15 mm (0.045 in)
30 Row
BGA
Vertical
10 mm, 12 mm, 14 mm, 17 mm
1 A
600 V
- 40 C
+ 105 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
NeXLev
Tray
品牌: Amphenol TCS
組裝國家: Not Available
擴散國: Not Available
原產國: MX
產品類型: Board to Board & Mezzanine Connectors
原廠包裝數量: 20
子類別: Board to Board & Mezzanine Connectors
公司名稱: NeXLev
找到產品:
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所選屬性: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

Amphenol TCS NeXLev®高密度並行板對板連接器

Amphenol TCS NeXLev®產品系列特有高密度並行板對板連接器可處理高達12.5 Gbps的資料傳輸率。為滿足夾層板應用中日益增加的帶寬要求而開發,NeXLev可讓設計工程師將高引腳數目的裝置重新安放到夾層卡或模塊卡上,從而簡化板上繞線,並優化系統性能。Amphenol TCS NeXLev高密度並行板對板連接器的堅固和防損壞設計包括高達每線性釐米57個實數訊號(每線性英吋145個訊號)、用於精確對齊的球柵陣列、一個用於提高SMT處理量的合規型BGA式附件,以及堅固的晶圓結構。晶圓可繞線支援單端或差動對架構。