Name: Advanced Thermal Solutions ATS037037005-MF-12D
Brand: Advanced Thermal Solutions
SKU: 984-AT037037005MF12D
Price: 46.03 HKD
Availability: InStock

說明：

散熱器 maxiFLOW BGA Heat Sink, Slant Fin, No TIM, Black Anodized, 37x37x5mm (LxWxH)

Pricing (HKD)

數量	單價	總價
	HK$46.03	HK$46.03
	HK$38.88	HK$388.80
	HK$36.83	HK$1,841.50
	HK$35.76	HK$3,576.00
	HK$34.03	HK$6,806.00
	HK$33.13	HK$16,565.00
	HK$31.89	HK$31,890.00
5,000	報價

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商品屬性	屬性值	選擇屬性
製造商:	Advanced Thermal Solutions
產品類型:	散熱器
RoHS:
產品:	Heat Sinks
設計目的:	maxiFLOW BGA
安裝風格:	PCB
吸熱材料:	Aluminum
散熱片類型:	Slanted Vane
熱敏電阻:	19.6 C/W
長度:	37 mm
寬度:	37 mm
高度:	5 mm
品牌:	Advanced Thermal Solutions
色彩:	Black
封裝:	Bulk
產品類型:	Heat Sinks
系列:	BGA High Aspect Ratio
原廠包裝數量:	100
子類別:	Heat Sinks
公司名稱:	Value-Line Platform/maxiFLOW
類型:	Component

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所選屬性: 0

篩選文檔:

規格書

ATS037037005-MF-12D 規格書 (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

Slant Fin Value-Line Heat Sinks

Advanced Thermal Solutions Slant Fin Value-Line Heat Sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This method reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The slant fin design offers additional surface area and, as a result, superior performance for applications that can accommodate larger fin-to-fin spacing. These slant fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks.