ATS-59006-C1-R0

Name: Advanced Thermal Solutions ATS-59006-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59006-C1-R0
Price: 181.99 HKD
Availability: OutOfStock

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Mouser 編號：

984-ATS-59006-C1-R0

製造商編號：

ATS-59006-C1-R0

製造商：

Advanced Thermal Solutions

說明：

散熱器 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 29mm, with PED, 29x37x11mm

規格書:

ATS-59006-C1-R0 規格書 (PDF)

ECAD模型:

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庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 13 週工廠預計生產時間。

輸入數量：

最少： 100 多個： 100

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$181.99	HK$18,199.00
	HK$178.70	HK$35,740.00
	HK$177.06	HK$88,530.00
1,000	報價

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商品屬性	屬性值	選擇屬性
製造商:	Advanced Thermal Solutions
產品類型:	散熱器
RoHS:
產品:	Heat Sink Assemblies
設計目的:	BGA
安裝風格:	Snap On
吸熱材料:	Aluminum
散熱片類型:	maxiFLOW
熱敏電阻:	6.2 C/W
長度:	37 mm
寬度:	29 mm
高度:	11 mm
品牌:	Advanced Thermal Solutions
色彩:	Black
封裝:	Bulk
產品類型:	Heat Sinks
系列:	maxiGRIP HS ASM - Custom
原廠包裝數量:	100
子類別:	Heat Sinks
公司名稱:	maxiFLOW maxiGRIP
類型:	Component

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所選屬性: 0

篩選文檔:

規格書

ATS-59006-C1-R0 規格書 (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 7616995190
TARIC:: 7616991099
MXHTS:: 7616995195
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.