45204-600230

3M Electronic Solutions Division
517-45204-600230
45204-600230

製造商：

說明：
集管和線殼 4P, .050" Pitch HDR Vert Thru-Hole,30Au

規格書:
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供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 504   多個： 504
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$12.08 HK$6,088.32
HK$11.67 HK$11,763.36
HK$11.01 HK$27,745.20

商品屬性 屬性值 選擇屬性
3M
產品類型: 集管和線殼
RoHS:  
Headers
Ribbon Cable
4 Position
1.27 mm (0.05 in)
2 Row
1.27 mm (0.05 in)
Through Hole
Solder Pin
Straight
Pin (Male)
Gold
452
- 55 C
+ 105 C
Each
品牌: 3M Electronic Solutions Division
觸點材料: Copper Alloy
额定电流: 1 A
易燃性等級: UL 94 V-0
外殼材料: Liquid Crystal Polymer (LCP)
閉鎖類型: Unlatched
產品類型: Headers & Wire Housings
原廠包裝數量: 504
子類別: Headers & Wire Housings
額定電壓: 125 V
零件號別名: 7100243434
每件重量: 842 mg
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所選屬性: 0

規格書

此功能需要啟用JavaScript。

CNHTS:
8538900000
CAHTS:
8536900090
USHTS:
8536694040
JPHTS:
853690000
KRHTS:
8536909090
TARIC:
8536693000
BRHTS:
85369090
ECCN:
EAR99

452 Series 1.27mm Shrouded Boardmount Headers

3M 452 Series 1.27mm (0.050") Shrouded Boardmount Headers are compact, robust mating connectors in a fine-pitch system allowing high connection density in a small space. A shroud or four-wall box protects two rows of copper alloy pins spaced 1.27mm apart. 30μ" gold and gold flash plating options are available on the wiping area for multiple mating/unmating cycles and price points according to engineering requirements and budget. Optional latches on the 3M 452 Shrouded Boardmount Headers provide a mechanical means to secure the mating socket connector during use or remove it for maintenance or repair. Designers can select from vertical or right-angle versions with thru-hole solder tails. Gull-wing solder tails are offered for surface-mount processing and tape and reel packaging to enable high-volume manufacturing.

450 Wire-to-Board Systems

3M 450 Wire-to-Board Systems is a complete end-to-end interconnect system intended for wire-to-board applications using 0.025" flat ribbon cable. It is a two-part system consisting of a boardmount header and a wiremount socket. The mating components are designed on a 1.27mm or 0.050" grid. Compared to systems based on the 2.54mm (0.100") or 2.00mm grids, the finer pitch saves valuable space on the printed circuit board yet still delivers on performance, reliability, and cost savings.

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